China’s YMTC is building a new production line using homegrown tools to bypass U.S. sanctions and aims for a 15% NAND market share by 2026. The company has increased monthly wafer production to 150K and developed 294-layer 3D NAND technology. Despite challenges in tool localization, YMTC leads Chinese chipmakers and seeks to compete with global giants.
China’s YMTC is launching a new production line using domestically made tools to break free from U.S. sanctions. This move aims to reduce reliance on American technology and secure greater independence in the semiconductor industry.
YMTC plans to capture 15% of the global NAND market by late 2026. It is expanding monthly wafer production from 130K to 150K and currently produces 294-layer 3D NAND chips.
Despite challenges in fully localizing advanced tools like lithography, YMTC has reached a 45% localization rate—the highest among Chinese chipmakers. Success here could position YMTC as a serious competitor to Samsung and Micron, impacting the global NAND supply.